Application Deadline: 06/27/2022
The ‘Next Generation Integrated Photonic Sensing’ Photonics21 Mirror Group Eureka call for multilateral R&D&I projects invites interested (technology) enterprises, universities and research institutes to enter into international R&D collaborations that contribute to the development and deployment of novel integrated photonic sensors or sensor technologies.
- The call is open to enterprises, research institutes/organisations and universities.
- The project idea must represent international cooperation in the form of a specific project.
- The project consortia must consist of at least two independent legal entities (at least one private enterprise per country) requesting funding from at least two of the participating countries or regions.
- The project proposal must be in scope according to section 3 and clearly address the call topic.
- The project proposal should demonstrate an obvious advantage and added value resulting from the technological cooperation between the participants (e. g. increased knowledge base, commercial leads, access to R&D infrastructure etc.).
- The proposed project must be innovative and there must be a technological risk involved.
- The project proposal must include a commercialisation plan (with a timeline), demonstrating how the results of the project will be exploited, applied and/or commercialised through subsequent innovatory steps.
- The project proposal should demonstrate the contribution of all the partners from the participating countries on an equal base, and the project must be equally significant to them. At least, not morem than 70 % of the total eligible project costs shall be incurred by any single partner or by all partners from a single participating country collectively.
- The project must have a civilian purpose and aim at civilian use only.
- The requested project duration shall be limited to a maximum of 36 months, not withstanding possible subsequent extensions.
Project proposals must focus on at least one of the three subtopics:
- PICs (photonic integrated circuits):
- integrating photonics and electronics for novel photonic sensors and sensing systems, considering packaging and connection approaches, scalability, CMOS-compatibility, and new material systems
- QPICs (photonic quantum sensors):
- combining and integrating classical and quantum optics (e. g. onto a photonic chip) to use quantum properties or quantum phenomena to perform a measurement of a physical quantity
- Hybrid sensing:
- combining two or more sensing methods – at least one of which originates from the field of photonics – to enable new sensor applications or to substantially improve existing ones.
Official Website: Eureka Photonics Call 2022 for Multilateral Research Proposals